The Multimedia Solutions (MMS) BU of the Prysmian Group and its partners tde – trans data elektronik and Senko will be guests on the NTT Technology Experience Lab webcast on February 10, 2021 at 10 am. Entitled “Cabling in the Data Center – Efficient by Design,” the cable and network experts will provide information about high-density solutions in data centers in their presentations.
Free registration and agenda at https://www.brighttalk.com/webcast/15381/464444
On the way to more sustainability, the green data center is increasingly coming into focus. Innovative and efficient cabling infrastructures support this development. The use of improved dimensions, optical networks and cable miniaturization are an important step towards the greener data center.
In the webcast, Dominik Friedel, Business Development Manager, NTT Global Data Centers, and experienced experts from Prysmian Group, BU Multimedia Solutions, tde and Senko discuss what the potential of optimized cabling infrastructures is, which technologies support the path towards Green IT and how suitable solutions can be applied. They will provide valuable insights and answer questions on these topics.
The focus of the presentation by Gerard Pera, Product Manager FO Data Cables at BU MMS, will be on “Fiber Optic Cable Miniaturization in High-Speed Networks”. He will provide information on the technological evolution of Draka fiber optic cables towards smaller and improved dimensions, high-density solutions and other multimedia solutions for data centers and related applications. He will also talk about the current state of parallel optical cabling.
In his presentation “High-density in Data Centres”, Sascha Langer, Sales Consultant at tde, will discuss which cabling solutions companies can use to achieve greater space density and space savings in the data center. To be well equipped for the terabyte age, they should rely on reliable cables, innovative connectors in the patch area and proven multi-fiber technology in the rear.
Jarno Franke, Sales Account Manager at Senko, talks about the advantages of compact CS and SN connectors: “Thanks to their up to 40 percent smaller form factor compared to comparable LC duplex connectors, they can significantly increase the packing density in the patch area.